Intel® 186 Processors

Intel modularized the core architecture of the Intel 186 in order to better provide expandable peripheral functionality. The 186 Ex family is based on an improved, static, 1 micron design. All of the enhanced products run at 25 MHz. In addition, the 80C186Ex/C188Ex processors have a common set of base peripherals beneficial to many embedded applications. The Ex processors all support a standard numeric interface, an interrupt control unit, a chip-select unit, a DRAM refresh control unit, a power management unit, and three 16-bit timer/counters. The 186 Ex family was designed with a number of objectives, the most important being high integration, low power consumption and a small form factor.

The first objective is met by offering different Ex family members with varied peripheral sets. The variety of peripheral combinations available allows a designer to choose a "best fit" for their application. The second objective, low power, is met by offering a fully static device that operates down to 2.9-3.0 volts. The final objective, small form factor, is addressed by the Shrink Quad Flat Pack (SQFP) package. The idle mode allows the device to shut off the CPU clock, leaving all integrated peripherals active. Idle mode lowers processor current consumption by approximately 40 percent. Powerdown mode goes a step further, the clock input to the entire processor is disabled reducing device current consumption to transistor leakage (microamps). Low voltage operation offers numerous benefits to the system designer such as decreased power consumption, less heat generation and less noise.

The 13 MHz version of the 186 Ex processors are available in 3.3V versions which operate down to 2.9 volts. The 16 MHz versions as well operate at 3.3V down to 2.9 volts. The combination of power management functionality and optional low voltage operation make the 186 Ex family processors ideal for power sensitive applications. The small form factor is a major benefit of the SQFP package. The small package allows high integration while using minimal area. Another benefit inherent in smaller packages is reduced noise. The device lead frame that carries signals from the die to the package pins is smaller in the SQFP than it is in packages like QFP or PLCC. The decreased lead frame size decreases noise amplitude on outputs. The decreased inductance resulting from the small package and the elimination of a device socket reduce output noise. Lastly, combining the SQFP package and integration of the 186 Ex processors with low voltage operation offers an ideal solution for portable, low power, battery operated applications.